IDTCSPU877BV8
vs
IDTCSPU877BVG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
VFBGA, BGA52,6X10,25
VFBGA, BGA56,6X10,25
Pin Count
52
52
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
CSPU877
CSPU877
Input Conditioning
DIFFERENTIAL
DIFFERENTIAL
JESD-30 Code
R-XBGA-B52
R-XBGA-B52
JESD-609 Code
e0
e1
Length
7 mm
7 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.009 A
0.009 A
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
52
52
Number of True Outputs
10
10
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA52,6X10,25
BGA56,6X10,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.04 ns
0.04 ns
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
4.5 mm
4.5 mm
fmax-Min
340 MHz
340 MHz
Base Number Matches
1
1
Pbfree Code
Compare IDTCSPU877BV8 with alternatives
Compare IDTCSPU877BVG with alternatives