IDT7MPV4170SA11M vs MCM72F6ADG9 feature comparison

IDT7MPV4170SA11M Integrated Device Technology Inc

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MCM72F6ADG9 Freescale Semiconductor

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MOTOROLA SEMICONDUCTOR PRODUCTS
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 11 ns 9 ns
JESD-30 Code R-XDMA-N168 R-PDMA-N168
JESD-609 Code e0
Memory Density 4718592 bit 4718592 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 72 72
Number of Functions 1
Number of Ports 1
Number of Terminals 168 168
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX72 64KX72
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.465 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Base Number Matches 1 3
Package Description DIMM, DIMM168
I/O Type COMMON
Package Code DIMM
Package Equivalence Code DIMM168
Power Supplies 3.3 V
Supply Current-Max 0.9 mA
Terminal Pitch 1.27 mm

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