IDT79RC32V364133DAI
vs
HD6417718RF100
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
HITACHI LTD
|
Part Package Code |
QFP
|
QFP
|
Package Description |
20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
|
LFQFP, QFP144,.71SQ,16
|
Pin Count |
144
|
144
|
Reach Compliance Code |
compliant
|
unknown
|
Address Bus Width |
32
|
26
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
133 MHz
|
100 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
JESD-609 Code |
e0
|
|
Length |
20 mm
|
20 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
85 °C
|
75 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
240
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.7 mm
|
Speed |
133 MHz
|
100 MHz
|
Supply Voltage-Max |
3.465 V
|
3.6 V
|
Supply Voltage-Min |
3.135 V
|
3.15 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
20 mm
|
20 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
3
|
2
|
ECCN Code |
|
3A991.A.2
|
HTS Code |
|
8542.31.00.01
|
Package Equivalence Code |
|
QFP144,.71SQ,16
|
Supply Current-Max |
|
200 mA
|
Technology |
|
CMOS
|
|
|
|
Compare IDT79RC32V364133DAI with alternatives
Compare HD6417718RF100 with alternatives