IDT79R3041-33PF vs NG80386LPSX25 feature comparison

IDT79R3041-33PF Integrated Device Technology Inc

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NG80386LPSX25 Intel Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEL CORP
Part Package Code QFP QFP
Package Description CAVITY UP, TQFP-100 BQFP,
Pin Count 100 100
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature BURST BUS; 5 PIPELINE STAGES CONTROL ROM; BARREL SHIFTER
Address Bus Width 32 24
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 66.67 MHz 50 MHz
External Data Bus Width 32 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G100 S-PQFP-G100
JESD-609 Code e0
Length 14 mm 19.05 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3
Number of DMA Channels
Number of External Interrupts 6 2
Number of Serial I/Os
Number of Terminals 100 100
On Chip Data RAM Width
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP BQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, BUMPER
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 1.6 mm 4.57 mm
Speed 33 MHz 25 MHz
Supply Current-Max 370 mA 280 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.635 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm 19.05 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 1 1

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Compare NG80386LPSX25 with alternatives