IDT79R3041-33PF vs TS80C188EC20 feature comparison

IDT79R3041-33PF Integrated Device Technology Inc

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TS80C188EC20 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEL CORP
Part Package Code QFP QFP
Package Description CAVITY UP, TQFP-100 QFP, QFP100,.7X.9,32
Pin Count 100 100
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature BURST BUS; 5 PIPELINE STAGES DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
Address Bus Width 32 20
Bit Size 32 16
Boundary Scan NO NO
Clock Frequency-Max 66.67 MHz 40 MHz
External Data Bus Width 32 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 14 mm 20 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3
Number of DMA Channels 4
Number of External Interrupts 6 9
Number of Serial I/Os 2
Number of Terminals 100 100
On Chip Data RAM Width
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QFP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 1.6 mm 3.15 mm
Speed 33 MHz 20 MHz
Supply Current-Max 370 mA 100 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 5 2
Package Equivalence Code QFP100,.7X.9,32

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