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IDT74SSTVN16859CPAG vs SSTV16859EC,557 feature comparison

IDT74SSTVN16859CPAG Integrated Device Technology Inc

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SSTV16859EC,557 NXP Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code TSSOP BGA
Package Description GREEN, TSSOP-64 LFBGA, BGA96,6X16,32
Pin Count 64 96
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTV SSTV
JESD-30 Code R-PDSO-G64 R-PBGA-B96
JESD-609 Code e3 e0
Length 17 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 1
Number of Bits 13 13
Number of Functions 1 1
Number of Terminals 64 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP LFBGA
Package Equivalence Code TSSOP64,.32,20 BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 2.4 ns 2.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.5 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 6.1 mm 5.5 mm
fmax-Min 220 MHz 200 MHz
Base Number Matches 2 1
Manufacturer Package Code SOT536-1
Logic » FF/Latches
Logic » FF/Latches

Compare IDT74SSTVN16859CPAG with alternatives

Compare SSTV16859EC,557 with alternatives