IDT74LVCH32245ABFG8 vs SN74LVCH32245AGKER feature comparison

IDT74LVCH32245ABFG8 Integrated Device Technology Inc

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SN74LVCH32245AGKER Texas Instruments

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description GREEN, LFBGA-96 LFBGA-96
Pin Count 96 96
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e1 e0
Length 13.5 mm 13.5 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Moisture Sensitivity Level 3 2
Number of Bits 8 8
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 96 96
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 4.7 ns 7.1 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 5.5 mm 5.5 mm
Base Number Matches 2 1
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Max I(ol) 0.024 A
Package Equivalence Code BGA96,6X16,32
Packing Method TR
Peak Reflow Temperature (Cel) 235
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 4 ns
Time@Peak Reflow Temperature-Max (s) 20

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