IDT74LVCH244APG8 vs 74LVCH244APW,112 feature comparison

IDT74LVCH244APG8 Integrated Device Technology Inc

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74LVCH244APW,112 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP2
Package Description TSSOP, 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
Pin Count 20 20
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 6.5 mm 6.5 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 6.9 ns 9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 1.2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 4.4 mm 4.4 mm
Base Number Matches 1 2
Manufacturer Package Code SOT360-1
Factory Lead Time 4 Weeks
Control Type ENABLE LOW
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP20,.25
Packing Method TUBE
Prop. Delay@Nom-Sup 7.5 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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