IDT74LVC157APG vs 74LCX157MTCX feature comparison

IDT74LVC157APG Integrated Device Technology Inc

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74LCX157MTCX onsemi

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC ONSEMI
Part Package Code TSSOP
Package Description TSSOP, TSSOP16,.25 TSSOP-16
Pin Count 16
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Length 5 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP16,.25 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 240 260
Prop. Delay@Nom-Sup 5.2 ns 5.8 ns
Propagation Delay (tpd) 5.9 ns 7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 30
Width 4.4 mm 4.4 mm
Base Number Matches 2 1
Pbfree Code Yes
Manufacturer Package Code 948AH
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Packing Method TR

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