IDT74FCT151TQ vs QS74FCT157CTPB feature comparison

IDT74FCT151TQ Integrated Device Technology Inc

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QS74FCT157CTPB Quality Semiconductor Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC QUALITY SEMICONDUCTOR INC
Part Package Code SOIC
Package Description SSOP, SSOP16,.25 ,
Pin Count 16
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01
Family FCT FCT
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e0
Length 4.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.048 A
Moisture Sensitivity Level 1
Number of Functions 1 4
Number of Inputs 8 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Equivalence Code SSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 10.5 ns
Propagation Delay (tpd) 7.5 ns 5.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 3.9116 mm
Base Number Matches 1 1

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