QS74FCT157CTPB
vs
IDT74FCT157CTP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
QUALITY SEMICONDUCTOR INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
,
DIP, DIP16,.3
Reach Compliance Code
unknown
not_compliant
Family
FCT
FCT
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
5.2 ns
4.3 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
16
HTS Code
8542.39.00.01
JESD-609 Code
e0
Length
19.1135 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.048 A
Moisture Sensitivity Level
1
Package Equivalence Code
DIP16,.3
Peak Reflow Temperature (Cel)
240
Prop. Delay@Nom-Sup
4.3 ns
Seated Height-Max
4.191 mm
Terminal Finish
Tin/Lead (Sn85Pb15)
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
20
Width
7.62 mm
Compare QS74FCT157CTPB with alternatives
Compare IDT74FCT157CTP with alternatives