IDT74AUCR16245BVI8
vs
74AUCH16245BVI8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
CABGA
Package Description
TFBGA, BGA56,6X10,25
VFBGA-56
Pin Count
56
56
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
COMMON CONTROL
COMMON CONTROL
Count Direction
BIDIRECTIONAL
BIDIRECTIONAL
Family
AUC
AUC
JESD-30 Code
R-PBGA-B56
R-PBGA-B56
JESD-609 Code
e0
e0
Length
7 mm
Logic IC Type
BUS TRANSCEIVER
BUS TRANSCEIVER
Max I(ol)
0.0001 A
0.0001 A
Number of Bits
8
8
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
56
56
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE WITH SERIES RESISTOR
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
BGA
Package Equivalence Code
BGA56,6X10,25
BGA56,6X10,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY
Packing Method
TR
TR
Propagation Delay (tpd)
3.6 ns
3.1 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.05 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.8 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
BOTTOM
BOTTOM
Width
4.5 mm
Base Number Matches
1
1
Manufacturer Package Code
BV56
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Compare IDT74AUCR16245BVI8 with alternatives
Compare 74AUCH16245BVI8 with alternatives