IDT74AUC164245BVI8 vs IDT74AUC16245BVGI feature comparison

IDT74AUC164245BVI8 Integrated Device Technology Inc

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IDT74AUC16245BVGI Integrated Device Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description VFBGA-56 TFBGA,
Pin Count 56 48
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Family AUC AUC
JESD-30 Code R-PBGA-B56 R-PBGA-B48
JESD-609 Code e0 e1
Length 7 mm 7 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Max I(ol) 0.0001 A
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 56 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA56,6X10,25 BGA56,6X10,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Packing Method TR
Propagation Delay (tpd) 4.5 ns 3.1 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.05 mm 1.05 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Width 4.5 mm 4.5 mm
Base Number Matches 1 1
Pbfree Code Yes

Compare IDT74AUC164245BVI8 with alternatives

Compare IDT74AUC16245BVGI with alternatives