IDT74ALVCH162245PAG8
vs
VC16245ADGG
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
TSSOP
|
|
Package Description |
0.50 MM PITCH, GREEN, TSSOP-48
|
TSSOP,
|
Pin Count |
48
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
WITH DIRECTION CONTROL
|
WITH DIRECTION CONTROL
|
Family |
ALVC/VCX/A
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
JESD-609 Code |
e3
|
|
Length |
12.5 mm
|
12.5 mm
|
Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
8
|
8
|
Number of Functions |
2
|
2
|
Number of Ports |
2
|
2
|
Number of Terminals |
48
|
48
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE WITH SERIES RESISTOR
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Propagation Delay (tpd) |
4.7 ns
|
5.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
1.2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
6.1 mm
|
6.1 mm
|
Base Number Matches |
1
|
11
|
Load Capacitance (CL) |
|
50 pF
|
|
|
|
Compare IDT74ALVCH162245PAG8 with alternatives
Compare VC16245ADGG with alternatives