IDT73210ATC vs IDT73720J8 feature comparison

IDT73210ATC Integrated Device Technology Inc

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IDT73720J8 Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP LCC
Package Description DIP, QCCJ,
Pin Count 32 68
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature SINGLE LEVEL PIPELINE REGISTER FROM A TO B; TWO LEVEL PIPELINE REGISTER FROM B TO A BYTE CONTROL ON ALL THREE PORTS
Family 73 73
JESD-30 Code R-CDIP-T24 S-PQCC-J68
JESD-609 Code e0 e0
Length 40.894 mm 24.2062 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type REGISTERED BUS TRANSCEIVER BUS EXCHANGER
Number of Bits 9 16
Number of Functions 1 1
Number of Ports 2 3
Number of Terminals 24 68
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP32,.4 LDCC68,1.0SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Propagation Delay (tpd) 9 ns 8.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.57 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 10.16 mm 24.2062 mm
Base Number Matches 2 1

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