IDT72V3640L6BB
vs
72V3640L6PFG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
Package Description
BGA, BGA144,12X12,40
TQFP-128
Pin Count
144
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Date Of Intro
1998-10-01
Access Time-Max
4 ns
4 ns
Additional Feature
RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
Clock Frequency-Max (fCLK)
100 MHz
Cycle Time
6 ns
6 ns
JESD-30 Code
S-PBGA-B144
R-PQFP-G128
JESD-609 Code
e0
Length
13 mm
20 mm
Memory Density
36864 bit
36864 bit
Memory IC Type
OTHER FIFO
Memory Width
36
36
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
144
128
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1KX36
1KX36
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFQFP
Package Equivalence Code
BGA144,12X12,40
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.97 mm
1.6 mm
Standby Current-Max
0.015 A
Supply Current-Max
0.04 mA
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
13 mm
14 mm
Base Number Matches
1
2
Compare IDT72V3640L6BB with alternatives
Compare 72V3640L6PFG8 with alternatives