IDT72V251L10PF9 vs IDT72V251L10JG feature comparison

IDT72V251L10PF9 Integrated Device Technology Inc

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IDT72V251L10JG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFJ
Package Description PLASTIC, TQFP-32 QCCJ,
Pin Count 32 32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 6.5 ns 6.5 ns
Cycle Time 10 ns 10 ns
JESD-30 Code S-PQFP-G32 R-PQCC-J32
JESD-609 Code e0 e3
Length 7 mm 13.9954 mm
Memory Density 73728 bit 73728 bit
Memory IC Type OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX9 8KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP QCCJ
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 3.556 mm
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Matte Tin (Sn) - annealed
Terminal Form GULL WING J BEND
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position QUAD QUAD
Width 7 mm 11.4554 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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