IDT72V251L10JG vs IDT72V251L10PF feature comparison

IDT72V251L10JG Integrated Device Technology Inc

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IDT72V251L10PF Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ QFP
Package Description QCCJ, PLASTIC, TQFP-32
Pin Count 32 32
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 6.5 ns 6.5 ns
Cycle Time 10 ns 10 ns
JESD-30 Code R-PQCC-J32 S-PQFP-G32
JESD-609 Code e3 e0
Length 13.9954 mm 7 mm
Memory Density 73728 bit 73728 bit
Memory Width 9 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX9 8KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LQFP
Package Shape RECTANGULAR SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15)
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 20
Width 11.4554 mm 7 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 100 MHz
Memory IC Type OTHER FIFO
Package Equivalence Code TQFP32,.35SQ,32
Standby Current-Max 0.005 A
Supply Current-Max 0.02 mA

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