IDT72V235L10TFG8 vs IDT72235LB10TF9 feature comparison

IDT72V235L10TFG8 Integrated Device Technology Inc

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IDT72235LB10TF9 Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description LFQFP, PLASTIC, STQFP-64
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Date Of Intro 1998-08-01
Access Time-Max 6.5 ns 40 ns
Additional Feature EASILY EXPANDABLE IN DEPTH AND WIDTH
Cycle Time 10 ns 50 ns
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Length 10 mm 10 mm
Memory Density 36864 bit 36864 bit
Memory Width 18 9
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 2048 words 2048 words
Number of Words Code 2000 4000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX18 4KX9
Output Enable YES NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 10 mm 10 mm
Base Number Matches 1 1
Memory IC Type OTHER FIFO
Moisture Sensitivity Level 3
Supply Current-Max 0.15 mA

Compare IDT72V235L10TFG8 with alternatives

Compare IDT72235LB10TF9 with alternatives