IDT72V235L10TFG8
vs
72V235L10TFG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
TQFP
Package Description
LFQFP,
STQFP-64
Pin Count
64
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Date Of Intro
1998-08-01
1992-01-01
Access Time-Max
6.5 ns
6.5 ns
Additional Feature
EASILY EXPANDABLE IN DEPTH AND WIDTH
EASILY EXPANDABLE IN DEPTH AND WIDTH
Cycle Time
10 ns
10 ns
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
e3
Length
10 mm
10 mm
Memory Density
36864 bit
36864 bit
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2KX18
2KX18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
10 mm
10 mm
Base Number Matches
1
2
Manufacturer Package Code
PPG64
Clock Frequency-Max (fCLK)
100 MHz
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
3
Package Equivalence Code
QFP64,.47SQ,20
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.005 A
Supply Current-Max
0.03 mA
Time@Peak Reflow Temperature-Max (s)
30
Compare IDT72V235L10TFG8 with alternatives
Compare 72V235L10TFG with alternatives