IDT72T72115L6-7BB
vs
72T72115L6-7BBI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA324,18X18,40
BGA,
Pin Count
324
324
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
3.8 ns
Additional Feature
ASYNCHRONOUS OPERATION ALSO POSSIBLE
Clock Frequency-Max (fCLK)
150 MHz
Cycle Time
6.7 ns
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e0
e0
Length
19 mm
19 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
OTHER FIFO
Memory Width
72
72
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
324
324
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX72
128KX72
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA324,18X18,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.97 mm
1.97 mm
Standby Current-Max
0.05 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
19 mm
19 mm
Base Number Matches
4
2
Compare IDT72T72115L6-7BB with alternatives
Compare 72T72115L6-7BBI with alternatives