72T72115L6-7BBI
vs
IDT72V2113L6BC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
BGA,
LBGA, BGA100,10X10,40
Pin Count
324
100
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
JESD-30 Code
S-PBGA-B324
S-PBGA-B100
JESD-609 Code
e0
e0
Length
19 mm
11 mm
Memory Density
9437184 bit
4718592 bit
Memory Width
72
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
324
100
Number of Words
131072 words
262144 words
Number of Words Code
128000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX72
256KX18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.97 mm
1.5 mm
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
19 mm
11 mm
Base Number Matches
1
1
Date Of Intro
1998-11-01
Access Time-Max
4 ns
Additional Feature
ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE
Alternate Memory Width
9
Clock Frequency-Max (fCLK)
166 MHz
Cycle Time
6 ns
Memory IC Type
OTHER FIFO
Package Equivalence Code
BGA100,10X10,40
Standby Current-Max
0.015 A
Supply Current-Max
0.035 mA
Supply Voltage-Max (Vsup)
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
Compare 72T72115L6-7BBI with alternatives
Compare IDT72V2113L6BC with alternatives