IDT7280L25TDI vs IDT7200L25TP feature comparison

IDT7280L25TDI Integrated Device Technology Inc

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IDT7200L25TP Rochester Electronics LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 65 ns 25 ns
Cycle Time 80 ns 35 ns
JESD-30 Code R-GDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Length 37.1475 mm 34.671 mm
Memory Density 36864 bit 2304 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 256 words 256 words
Number of Words Code 4000 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4KX9 256X9
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm 4.572 mm
Supply Current-Max 0.07 mA 0.08 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
Additional Feature RETRANSMIT

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