IDT72271L20G vs 72271LA20TF feature comparison

IDT72271L20G Integrated Device Technology Inc

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72271LA20TF Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PGA TQFP
Package Description PGA-68 STQFP-64
Pin Count 68 64
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature RETRANSMIT; AUTOMATIC POWER-DOWN RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
Cycle Time 20 ns 20 ns
JESD-30 Code S-CPGA-P68 S-PQFP-G64
JESD-609 Code e3 e0
Length 29.464 mm 10 mm
Memory Density 294912 bit 294912 bit
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 68 64
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX9 32KX9
Output Characteristics 3-STATE
Output Enable YES YES
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA LFQFP
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.207 mm 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form PIN/PEG GULL WING
Terminal Pitch 2.54 mm 0.5 mm
Terminal Position PERPENDICULAR QUAD
Width 29.464 mm 10 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Manufacturer Package Code PP64
Access Time-Max 12 ns
Clock Frequency-Max (fCLK) 50 MHz
Memory IC Type OTHER FIFO
Moisture Sensitivity Level 3
Package Equivalence Code QFP64,.47SQ,20
Peak Reflow Temperature (Cel) 240
Standby Current-Max 0.017 A
Supply Current-Max 0.075 mA
Time@Peak Reflow Temperature-Max (s) 30

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