IDT7201SA50J
vs
7201LA50JG8
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
QFJ
Package Description
PLASTIC, LCC-32
QCCJ,
Pin Count
32
32
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
50 ns
50 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
65 ns
65 ns
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e0
e3
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512X9
512X9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.125 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn) - annealed
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
30
Base Number Matches
1
1
Pbfree Code
Yes
Length
13.97 mm
Seated Height-Max
3.55 mm
Width
11.43 mm
Compare IDT7201SA50J with alternatives
Compare 7201LA50JG8 with alternatives