IDT7200S50LB8
vs
IDT7200L50TPG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
DIP
Package Description
LCC-32
DIP, DIP28,.3
Pin Count
32
28
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15 ns
50 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
25 ns
65 ns
JESD-30 Code
R-CQCC-N32
R-PDIP-T28
JESD-609 Code
e0
e3
Memory Density
147456 bit
2304 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
32
28
Number of Words
256 words
256 words
Number of Words Code
16000
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
16KX9
256X9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QCCN
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.165 mA
0.08 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
QUAD
DUAL
Base Number Matches
1
1
Pbfree Code
Rohs Code
Clock Frequency-Max (fCLK)
15 MHz
Length
34.671 mm
Package Equivalence Code
DIP28,.3
Seated Height-Max
4.572 mm
Standby Current-Max
0.005 A
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare IDT7200S50LB8 with alternatives
Compare IDT7200L50TPG with alternatives