IDT7200S50J8
vs
7200S50J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
Package Description
PLASTIC, LCC-32
QCCJ, LDCC32,.5X.6
Pin Count
32
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
50 ns
50 ns
Additional Feature
RETRANSMIT
Cycle Time
65 ns
65 ns
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e0
e0
Memory Density
2304 bit
2304 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256X9
256X9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Position
QUAD
QUAD
Base Number Matches
1
1
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
1
Package Equivalence Code
LDCC32,.5X.6
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.005 A
Supply Current-Max
0.08 mA
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
20
Compare IDT7200S50J8 with alternatives
Compare 7200S50J with alternatives