IDT7200L50SOB
vs
IDT7200L50TDG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
SOIC-28
DIP, DIP28,.3
Pin Count
28
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
50 ns
50 ns
Cycle Time
65 ns
65 ns
JESD-30 Code
R-PDSO-G28
R-GDIP-T28
JESD-609 Code
e0
e3
Length
18.3642 mm
37.1475 mm
Memory Density
2304 bit
2304 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
256X9
256X9
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
5.08 mm
Supply Current-Max
0.1 mA
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
8.763 mm
7.62 mm
Base Number Matches
1
1
Additional Feature
RETRANSMIT
Clock Frequency-Max (fCLK)
15 MHz
Package Equivalence Code
DIP28,.3
Standby Current-Max
0.005 A
Compare IDT7200L50SOB with alternatives
Compare IDT7200L50TDG with alternatives