IDT7200L50TDG vs IDT7200S50TP feature comparison

IDT7200L50TDG Integrated Device Technology Inc

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IDT7200S50TP Integrated Device Technology Inc

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP28,.3 0.300 INCH, THIN, PLASTIC, DIP-28
Pin Count 28 28
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Additional Feature RETRANSMIT RETRANSMIT
Clock Frequency-Max (fCLK) 15 MHz
Cycle Time 65 ns 65 ns
JESD-30 Code R-GDIP-T28 R-PDIP-T28
JESD-609 Code e3 e0
Length 37.1475 mm
Memory Density 2304 bit 2304 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256X9 256X9
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.3 DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.005 A 0.005 A
Supply Current-Max 0.08 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN Tin/Lead (Sn85Pb15)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
Output Characteristics 3-STATE

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