IDT7200L50P vs IDT7200L50JB feature comparison

IDT7200L50P Integrated Device Technology Inc

Buy Now Datasheet

IDT7200L50JB Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP QFJ
Package Description 0.600 INCH, PLASTIC, DIP-28 QCCJ,
Pin Count 28 32
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Additional Feature RETRANSMIT
Clock Frequency-Max (fCLK) 15 MHz
Cycle Time 65 ns 65 ns
JESD-30 Code R-PDIP-T28 R-PQCC-J32
JESD-609 Code e0 e0
Memory Density 2304 bit 2304 bit
Memory IC Type OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 256X9 256X9
Output Characteristics 3-STATE
Output Enable NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0005 A
Supply Current-Max 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 20
Base Number Matches 1 1
Pbfree Code No
Length 13.97 mm
Seated Height-Max 3.55 mm
Width 11.43 mm

Compare IDT7200L50P with alternatives

Compare IDT7200L50JB with alternatives