IDT7200L50JB vs IDT7200S50J feature comparison

IDT7200L50JB Integrated Device Technology Inc

Buy Now Datasheet

IDT7200S50J Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ QFJ
Package Description QCCJ, PLASTIC, LCC-32
Pin Count 32 32
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Cycle Time 65 ns 65 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e0 e0
Length 13.97 mm
Memory Density 2304 bit 2304 bit
Memory Width 9 9
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 256X9 256X9
Output Enable NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.55 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.43 mm
Base Number Matches 1 1
Additional Feature RETRANSMIT
Memory IC Type OTHER FIFO
Output Characteristics 3-STATE
Package Equivalence Code LDCC32,.5X.6
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.005 A
Supply Current-Max 0.08 mA
Time@Peak Reflow Temperature-Max (s) 20

Compare IDT7200L50JB with alternatives

Compare IDT7200S50J with alternatives