IDT7200L50JB
vs
IDT7200S50J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
QFJ
Package Description
QCCJ,
PLASTIC, LCC-32
Pin Count
32
32
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
50 ns
50 ns
Cycle Time
65 ns
65 ns
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e0
e0
Length
13.97 mm
Memory Density
2304 bit
2304 bit
Memory Width
9
9
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
256X9
256X9
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.55 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
Base Number Matches
1
1
Additional Feature
RETRANSMIT
Memory IC Type
OTHER FIFO
Output Characteristics
3-STATE
Package Equivalence Code
LDCC32,.5X.6
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.005 A
Supply Current-Max
0.08 mA
Time@Peak Reflow Temperature-Max (s)
20
Compare IDT7200L50JB with alternatives
Compare IDT7200S50J with alternatives