IDT71V3557SA75BGI8
vs
CY7C1394V18-200BZC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
14 X 22 MM, PLASTIC, BGA-119
13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
Pin Count
119
165
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
0.38 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B119
R-PBGA-B165
JESD-609 Code
e0
e0
Length
22 mm
15 mm
Memory Density
4718592 bit
18874368 bit
Memory IC Type
ZBT SRAM
DDR SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
119
165
Number of Words
131072 words
524288 words
Number of Words Code
128000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX36
512KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.36 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.465 V
1.9 V
Supply Voltage-Min (Vsup)
3.135 V
1.7 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
13 mm
Base Number Matches
1
1
Pbfree Code
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
SEPARATE
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Standby Voltage-Min
1.7 V
Compare IDT71V3557SA75BGI8 with alternatives
Compare CY7C1394V18-200BZC with alternatives