CY7C1394V18-200BZC
vs
UPD464318LS1-A65
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
NEC ELECTRONICS CORP
Part Package Code
BGA
BGA
Package Description
13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
BGA,
Pin Count
165
119
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.38 ns
3.5 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
R-PBGA-B119
JESD-609 Code
e0
Length
15 mm
22 mm
Memory Density
18874368 bit
4718592 bit
Memory IC Type
DDR SRAM
CACHE SRAM
Memory Width
36
18
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
165
119
Number of Words
524288 words
262144 words
Number of Words Code
512000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
512KX36
256KX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
BGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
2.3 mm
Standby Voltage-Min
1.7 V
Supply Voltage-Max (Vsup)
1.9 V
3.45 V
Supply Voltage-Min (Vsup)
1.7 V
3.15 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
BICMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
14 mm
Base Number Matches
1
2
Compare CY7C1394V18-200BZC with alternatives
Compare UPD464318LS1-A65 with alternatives