IDT71V2546XS133PF
vs
MT58V2MV18FF-7.5
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
QFP
BGA
Package Description
LQFP,
TBGA,
Pin Count
100
165
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
4.2 ns
7.5 ns
Additional Feature
PIPELINED ARCHITECTURE
FLOW-THROUGH ARCHITECTURE
JESD-30 Code
R-PQFP-G100
R-PBGA-B165
JESD-609 Code
e0
e1
Length
20 mm
17 mm
Memory Density
4718592 bit
37748736 bit
Memory IC Type
ZBT SRAM
STANDARD SRAM
Memory Width
36
18
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
100
165
Number of Words
131072 words
2097152 words
Number of Words Code
128000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX36
2MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.465 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
15 mm
Base Number Matches
1
1
Compare IDT71V2546XS133PF with alternatives
Compare MT58V2MV18FF-7.5 with alternatives