IDT71V2546XS133PF
vs
K7I163684B-FC330
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
QFP
BGA
Package Description
LQFP,
LBGA,
Pin Count
100
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
4.2 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PQFP-G100
R-PBGA-B165
JESD-609 Code
e0
e0
Length
20 mm
15 mm
Memory Density
4718592 bit
18874368 bit
Memory IC Type
ZBT SRAM
DDR SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
100
165
Number of Words
131072 words
524288 words
Number of Words Code
128000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX36
512KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.465 V
1.9 V
Supply Voltage-Min (Vsup)
3.135 V
1.7 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
13 mm
Base Number Matches
1
1
Compare IDT71V2546XS133PF with alternatives
Compare K7I163684B-FC330 with alternatives