IDT7187S25C
vs
MT5C6401C-35/IT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MICROSS COMPONENTS
Part Package Code
DIP
DIP
Package Description
0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-22
,
Pin Count
22
22
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
I/O Type
SEPARATE
JESD-30 Code
R-CDIP-T22
R-CDIP-T22
JESD-609 Code
e0
Length
27.432 mm
Memory Density
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
Number of Functions
1
Number of Ports
1
Number of Terminals
22
22
Number of Words
65536 words
Number of Words Code
64000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
64KX1
Output Characteristics
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
Package Equivalence Code
DIP22,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
Compare IDT7187S25C with alternatives
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