IDT7143SA70J8
vs
IDT7143LA25PF9
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
QFP
Package Description
QCCJ,
LFQFP,
Pin Count
68
100
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Base Number Matches
1
1
Pbfree Code
Rohs Code
Access Time-Max
25 ns
JESD-30 Code
S-PQFP-G100
JESD-609 Code
e0
Length
14 mm
Memory Density
32768 bit
Memory IC Type
MULTI-PORT SRAM
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
100
Number of Words
2048 words
Number of Words Code
2000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
2KX16
Package Body Material
PLASTIC/EPOXY
Package Code
LFQFP
Package Shape
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
14 mm
Compare IDT7143SA70J8 with alternatives
Compare IDT7143LA25PF9 with alternatives