IDT7140LA55PFB8
vs
IL4K-671342L-25:RD
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
TEMIC SEMICONDUCTORS
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
55 ns
|
25 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
S-PQFP-G64
|
S-CQCC-N48
|
| JESD-609 Code |
e0
|
|
| Memory Density |
8192 bit
|
32768 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
64
|
48
|
| Number of Words |
1024 words
|
4096 words
|
| Number of Words Code |
1000
|
4000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
1KX8
|
4KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFP
|
QCCN
|
| Package Equivalence Code |
QFP64,.66SQ,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Standby Current-Max |
0.004 A
|
|
| Standby Voltage-Min |
2 V
|
2 V
|
| Supply Current-Max |
0.14 mA
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
1
|
| Number of Functions |
|
1
|
| Output Enable |
|
YES
|
|
|
|
Compare IDT7140LA55PFB8 with alternatives
Compare IL4K-671342L-25:RD with alternatives