IDT7140LA55C vs 5962-8687515XX feature comparison

IDT7140LA55C Integrated Device Technology Inc

Buy Now Datasheet

5962-8687515XX Temic Semiconductors

Buy Now
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TEMIC SEMICONDUCTORS
Part Package Code DIP
Package Description SIDE BRAZED, DIP-48 CERAMIC, DIP-48
Pin Count 48
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 55 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code R-CDIP-T48 R-GDIP-T48
JESD-609 Code e0
Length 60.96 mm
Memory Density 8192 bit 8192 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 48 48
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1KX8 1KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP48,.6 DIP48,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm
Standby Current-Max 0.0015 A 0.004 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.11 mA 0.185 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 10 1
Screening Level MIL-STD-883

Compare IDT7140LA55C with alternatives

Compare 5962-8687515XX with alternatives