IDT7134SA25J
vs
7134LA25FGB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
QFP
Package Description
PLASTIC, LCC-52
0.750 X 0.750 INCH, 0.110 INCH HEIGHT, GREEN, CERAMIC, FP-48
Pin Count
52
48
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
Additional Feature
AUTOMATIC POWER-DOWN
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQCC-J52
S-CQFP-F48
JESD-609 Code
e0
e3
Length
19.1262 mm
Memory Density
32768 bit
32768 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
52
48
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
4KX8
4KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
QFF
Package Equivalence Code
LDCC52,.8SQ
QFL48,.75SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
Standby Current-Max
0.015 A
0.004 A
Standby Voltage-Min
4.5 V
2 V
Supply Current-Max
0.28 mA
0.26 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
J BEND
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Width
19.1262 mm
Base Number Matches
12
4
Date Of Intro
1988-01-01
Screening Level
MIL-PRF-38535
Compare IDT7134SA25J with alternatives
Compare 7134LA25FGB with alternatives