IDT71322L70L52 vs IDT71322S70JB feature comparison

IDT71322L70L52 Integrated Device Technology Inc

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IDT71322S70JB Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC LCC
Package Description HERMETIC SEALED, LCC-52 QCCJ,
Pin Count 52 52
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
Additional Feature BATTERY BACKUP OPERATION BATTERY BACKUP OPERATION
JESD-30 Code S-CQCC-N52 S-PQCC-J52
JESD-609 Code e0 e0
Length 19.05 mm 19.1262 mm
Memory Density 16384 bit 16384 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 2
Number of Terminals 52 52
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 2KX8 2KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCN QCCJ
Package Equivalence Code LCC52,.75SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2098 mm 4.57 mm
Standby Current-Max 0.0015 A
Standby Voltage-Min 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 19.05 mm 19.1262 mm
Base Number Matches 1 1
Pbfree Code No

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Compare IDT71322S70JB with alternatives