IDT71256S35EB vs MCM62L09CP20 feature comparison

IDT71256S35EB Integrated Device Technology Inc

Buy Now Datasheet

MCM62L09CP20 Motorola Mobility LLC

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MOTOROLA INC
Part Package Code DFP DIP
Package Description CERPACK-28 DIP,
Pin Count 28 28
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 20 ns
I/O Type COMMON
JESD-30 Code R-GDFP-F28 R-PDIP-T28
JESD-609 Code e0 e0
Length 18.288 mm 34.23 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 28
Number of Words 32768 words 65536 words
Number of Words Code 32000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 32KX8 64KX4
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP DIP
Package Equivalence Code FL28,.5
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 2.921 mm 4.318 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.165 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 12.446 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No

Compare IDT71256S35EB with alternatives

Compare MCM62L09CP20 with alternatives