IDT71256L45P
vs
EDI8832C100LB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
ELECTRONIC DESIGNS INC
Part Package Code
DIP
Package Description
0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-28
Pin Count
28
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
45 ns
100 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T28
R-CQCC-N32
JESD-609 Code
e0
e0
Length
36.576 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
28
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Equivalence Code
DIP28,.6
LCC32,.45X.55
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.699 mm
Standby Current-Max
0.00012 A
0.00085 A
Standby Voltage-Min
2 V
4.5 V
Supply Current-Max
0.1 mA
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn85Pb15)
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Width
15.24 mm
Base Number Matches
1
1
Screening Level
38535Q/M;38534H;883B
Compare IDT71256L45P with alternatives
Compare EDI8832C100LB with alternatives