IDT71256L45P
vs
CY7C199CNL-15ZXC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
TSOP
Package Description
0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-28
LEAD FREE, PLASTIC, TSOP-28
Pin Count
28
28
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
15 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T28
R-PDSO-G28
JESD-609 Code
e0
e4
Length
36.576 mm
11.8 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Ports
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSOP1
Package Equivalence Code
DIP28,.6
TSSOP28,.53,22
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.699 mm
1.02 mm
Standby Current-Max
0.00012 A
0.00015 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.1 mA
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.55 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
20
Width
15.24 mm
8 mm
Base Number Matches
1
1
Compare IDT71256L45P with alternatives
Compare CY7C199CNL-15ZXC with alternatives