IDT70V9159L6BFG
vs
70V9159L7BFG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
BGA
|
|
| Package Description |
10 X 10MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-100
|
BGA,
|
| Pin Count |
100
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
15 ns
|
7.5 ns
|
| Additional Feature |
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
PIPELINED OR FLOW THROUGH ARCHITECTURE
|
| JESD-30 Code |
S-PBGA-B100
|
S-PBGA-B100
|
| JESD-609 Code |
e3
|
|
| Length |
10 mm
|
|
| Memory Density |
73728 bit
|
73728 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
DUAL-PORT SRAM
|
| Memory Width |
9
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
8KX9
|
8KX9
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.5 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
10 mm
|
|
| Base Number Matches |
1
|
6
|
|
|
|
Compare IDT70V9159L6BFG with alternatives
Compare 70V9159L7BFG with alternatives