70V9159L7BFG
vs
709159L7BFI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
BGA,
10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
7.5 ns
Additional Feature
PIPELINED OR FLOW THROUGH ARCHITECTURE
FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code
S-PBGA-B100
S-PBGA-B100
Memory Density
73728 bit
73728 bit
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
8KX9
8KX9
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
2
Pbfree Code
Rohs Code
Part Package Code
CABGA
Pin Count
100
Manufacturer Package Code
BF100
Clock Frequency-Max (fCLK)
83 MHz
I/O Type
COMMON
JESD-609 Code
e0
Length
10 mm
Moisture Sensitivity Level
3
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
BGA100,10X10,32
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
Standby Current-Max
0.003 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.44 mA
Terminal Finish
TIN LEAD
Terminal Pitch
0.8 mm
Time@Peak Reflow Temperature-Max (s)
20
Width
10 mm
Compare 70V9159L7BFG with alternatives
Compare 709159L7BFI with alternatives