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IDT70V7519S166BF8 vs AS9C25256M2036L-133FC feature comparison

IDT70V7519S166BF8 Integrated Device Technology Inc

Buy Now Datasheet

AS9C25256M2036L-133FC Integrated Silicon Solution Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description TFBGA, BGA208,17X17,32 LFBGA,
Pin Count 208 208
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Total Weight 539.4
Category CO2 Kg 12 12
CO2 6472.799999999999
Compliance Temperature Grade Commercial: +0C to +70C Commercial: +0C to +70C
Candidate List Date 2024-01-23 2014-06-16
SVHC Over MCV 7439-92-1
CAS Accounted for Wt 78
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 1333-86-4, 7439-92-1, 7440-02-0
Conflict Mineral Status DRC Conflict Free DRC Conflict Free
Conflict Mineral Status Source CMRT V6.01 CMRT V4.01
Access Time-Max 12 ns 12 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
JESD-30 Code S-PBGA-B208 S-PBGA-B208
JESD-609 Code e0 e0
Length 15 mm 15 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 2
Number of Terminals 208 208
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX36 256KX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA208,17X17,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Standby Current-Max 0.015 A
Standby Voltage-Min 3.15 V
Supply Current-Max 0.945 mA
Supply Voltage-Max (Vsup) 3.45 V 2.6 V
Supply Voltage-Min (Vsup) 3.15 V 2.4 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 15 mm 15 mm
Base Number Matches 1 1
Memory » SRAMs
Memory » SRAMs

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