IDT70V7399S166BF
vs
70V3399S166BFG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
CABGA
Package Description
TFBGA, BGA208,17X17,32
15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208
Pin Count
208
208
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Total Weight
539.4
539.4
Category CO2 Kg
12
12
CO2
6472.799999999999
6472.799999999999
Compliance Temperature Grade
Commercial: +0C to +70C
Commercial: +0C to +70C
Candidate List Date
2024-01-23
2021-01-19
SVHC Over MCV
7439-92-1
CAS Accounted for Wt
78
78
CA Prop 65 Presence
YES
YES
CA Prop 65 CAS Numbers
1333-86-4, 7439-92-1, 7440-02-0
1333-86-4, 7440-02-0
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free
Conflict Mineral Status Source
CMRT V5.12
CMRT V6.01
Access Time-Max
12 ns
3.6 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
166 MHz
166 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B208
S-CBGA-B208
JESD-609 Code
e0
e1
Length
15 mm
15 mm
Memory Density
2359296 bit
2359296 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
208
208
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX18
128KX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
TFBGA
LFBGA
Package Equivalence Code
BGA208,17X17,32
BGA208,17X17,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.7 mm
Standby Current-Max
0.03 A
0.03 A
Standby Voltage-Min
3.15 V
3.15 V
Supply Current-Max
0.79 mA
0.5 mA
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
30
Width
15 mm
15 mm
Base Number Matches
1
2
Manufacturer Package Code
BFG208
EU RoHS Version
RoHS 2 (2015/863/EU)
EFUP
e
Compare IDT70V7399S166BF with alternatives
Compare 70V3399S166BFG with alternatives