IDT70V631S15BF vs 70T631S15BFGI feature comparison

IDT70V631S15BF Integrated Device Technology Inc

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70T631S15BFGI Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA
Package Description LFBGA, BGA208,17X17,32
Pin Count 208
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.A EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns
I/O Type COMMON
JESD-30 Code S-PBGA-B208
JESD-609 Code e0
Length 15 mm
Memory Density 4718592 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 208
Number of Words 262144 words
Number of Words Code 256000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA208,17X17,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 1.7 mm
Standby Current-Max 0.015 A
Standby Voltage-Min 3.15 V
Supply Current-Max 0.44 mA
Supply Voltage-Max (Vsup) 3.45 V
Supply Voltage-Min (Vsup) 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 15 mm
Base Number Matches 1 1

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Compare 70T631S15BFGI with alternatives