IDT70V3389S6BCI8
vs
70V3389S6BCI8
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
6 ns
|
6 ns
|
| Clock Frequency-Max (fCLK) |
83 MHz
|
83 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
1179648 bit
|
1179648 bit
|
| Memory IC Type |
APPLICATION SPECIFIC SRAM
|
APPLICATION SPECIFIC SRAM
|
| Memory Width |
18
|
18
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
256
|
256
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
64KX18
|
64KX18
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.03 A
|
0.03 A
|
| Standby Voltage-Min |
3.15 V
|
3.15 V
|
| Supply Current-Max |
0.36 mA
|
0.36 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare IDT70V3389S6BCI8 with alternatives
Compare 70V3389S6BCI8 with alternatives